January month is seeming to be a nice month for mobile chip manufacturers as yesterday Qualcomm launched the Snapdragon 870 and today MediaTek has bombarded the market with two new SoCs – Dimensity 1200 and 1100. As you can guess from the names of these SoCs, these are the most powerful chips from MediaTek so far. And Realme has announced that the company is launching a phone powered by the Dimensity 1200. It was announced by the company CEO Madhav Sheth and Realme Europe, on Twitter.
Realme has not yet specifically mentioned that the smartphone is going to be the Realme X9 Pro but has hinted via providing info like the smartphone will be from the Realme X series and one of the main highlights will be the ultra-sleek design. And based on what Frandroid says, this phone will the Realme X9 Pro. Frandroid also said that the device will have up to 12G of LPDDR5 RAM, a 108MP primary camera with two 13MP shooters, a 6.4 inches FHD+ 120Hz OLED display, and a 4500mAh battery, paired with 65W of fast charging. The phone will run on Realme UI 2.0 based on the latest Android 11.
Talking about the Dimensity 1200, the SoC is a 6 nm based octa-core chip that comes with Mali G77 MP9 GPU. Its CPU comprises of Corex-A78 based performance core with up to 3.0GHz clock speed and Cortex-A55 based efficiency cores at 2.0GHz. It is a 5G chip and comes with an integrated 5G modem.